Step 1:Front-end tool data preparation --- DFM

Step 2:Preparing the phototools for PCB image transfer

Step 3:Material Preparation

Step 4:Innerlayer imaging for multilayer PCB

Step 5:Etching inner layer in multilayer PCB production

Step 6:Register punch and Automatic Optical Inspection (AOI) of inner layers

Step 7:Lay-up and bond for multilayer PCB

Step 8: Drilling printed circuit boards

Step 9: Electroless copper deposition

Step10: Image the outer layers

Step11: Plating

Step12: Etch outer layers

Step13: AOI or electrical test of outer layers after etched

Step14: Apply soldermask

Step15: Surface finishes

Step16: Silk-screen and cure

Step17: Profiling

Step18: Bare board Electrical test

Step19: Final Quality Control

Step20: Packing & Shipping